MT Type inter-connector
MT inter-connector is suitable for the inspection of IC packages (BGA, LFBGA, LGA, QFP, etc.), especially those packages requiring high-frequency measurements.
Production Intro
- MT inter-connector is an anisotropic conductive sheet,
- made up of fine gold plated metallic wires, set in a sheet of soft silicone at high density.
- Features : Low resistance, short connection path, can maintain the integrity of the solder ball surface, highly reliable complete connection, high durability, low compression force and easy replacement.
- Operating temperature : -35℃~100℃.
Spec
- Suitable for IC testing with high pin count and high frequency.
- Applications : QFP, BGA, LGA, CSP, TSOP and other packaging methods such as Fine Pitch, high frequency, high pin count IC.
Product Contact
Howard Chen
- TOPCO SCIENTIFIC CO.,LTD.
- Manager
- Electronics Div Ⅱ., 3rd Business Unit
3F.-10, No.12, Fuxing 4th Rd., Qianzhen Dist., Kaohsiung City 806611, Taiwan
TEL: (07)537-7626 ext.7132
