High Pressure Clean System
The High Pressure Clean System presses the DIW to 2 Mpa~15 Mpa with a special pump, and reduces the water molecules through a special nozzle, and removes particles and adhesions on the surface of the product in a high-speed and high-quality manner.
Production Intro
- Just use the DIW no need to add detergent,high pressure and low flow can achieve ultra-high cleaning performance, which can greatly improve the yield of semiconductor/panel high-end manufacturing processes.
- The pump is designed for water self-lubrication, no additional or regular replacement of lubricating oil is required, which can completely avoid the risk of contamination.
- Simple construction of system components, small pump size, high mute efficiency, and quick maintenance.
- Long life time, few replacement parts, and low overhaul cost.
Spec
- Pump pressure : 2 Mpa～15 Mpa
- Filter specifications : source low-pressure side：1.2μm, high-pressure side：1.0μm
- Equipment reference size (L 1355mm *W 705mm *H 1570mm) Also adjust and order according to customer needs.
Product Contact
Sam Liu
- TOPCO SCIENTIFIC CO.,LTD.
- Dept. Manager
- Sales Dept.Ⅱ, Mechanical Equipment Div., 3rd Business Unit
6F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3684
