CMP Slurry
The company is the agent of Fujimi Inc. which is applied in the semiconductor CMP processes such as Oxide/Poly/W/Cu/TSV/Reclaim to achieve the best planarization performance.
Production Intro
Use:
- Oxide Slurry: PL–4217、PL–4219
- Poly Slurry: PL-6103、PL-6108
- W Slurry: PL–5107、PL–5111
- Cu & Barrier Slurry: PL–7105、PL–8105
- SiN Slurry: PL–6125N
- Rinse Slurry: PL–6501、PL–6502
- Si/Reclaim Wafer Slurry : GL–3105、GL–3108
Spec
- Drum Type: 220 kg
- Bottle Type: 20 kg
- Silica Base
- Warranty: 1 year life time
- Temperature: 0~43℃
Product Contact
Nick Han
- TOPCO SCIENTIFIC CO.,LTD.
- Senior Manager
- Sales Dept. II, High Performance Material Div., 5th Busines Unit
6F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3362