APK/UPK system
Auto-packing system is consummated to guide the design of silicon wafer manufacturing equipment to improve the safety, usability and cost saving.
Production Intro
Applies to pack/unpack 8~12 inch wafer for shipping and transferring.
APK (FOSB/FOUP/REEL/POD) :
- Loader/Unloader and inspection module
- FOSB/FOUP inspection module
- Wafer mapping & slot overlap inspection function
- Labeling and Inspection module
- Film sealing, folding & taping
- Self-developed vacuum function
UPK (FOSB/FOUP/POD) :
- RFID writing, reading and interface with MES
- Automatic tool(Knife) change function
- Consumables recycle (Including desiccant, packing bag)
Spec
- Customized uppon requests
Product Contact
Sam Lin
- TOPCO SCIENTIFIC CO.,LTD.
- Assistant Manager
- Advanced wafer & material Sales Dept.Ⅰ, Advanced wafer & material Div., 2nd Business Unit
4F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3413