Topco unveils a supply chain platform aimed at overseas market at SEMICON Taiwan 2022
Targeting opportunities in 5G, 3rd generation, automotive applications and the circular economy
Topco Scientific (5434), a major integrated service provider of semiconductor and key photoelectric materials, will showcase comprehensive solutions to the semiconductor supply chain: from semiconductor integration services, featured products for wafer fabrication to packaging and testing, as well as 3rd generation semiconductor and 5G applications in “SEMICON Taiwan 2022” from September 14 to 16 on the 4th floor, Taipei Nangang Exhibition Center, Hall 1. In the “Circular economy” zone, Topco will reveal services supporting green industries, including 100% wastewater recycling and zero emission technology, as well as ammonia nitrogen wastewater treatment, cleanroom construction and CFV (carbon footprint verification).
To share the latest innovative technologies and production, Topco will present “Low porosity coating technology for Semiconductor Parts” in TechXPOT on September 15 at 10:40 AM. In the forum, Topco will display low porosity coating technology applicable to various processes, corrosion-resistant porosity reducing materials and “Mass transfer Cu micro pin to replace solder ball in advance packaging” to support high-yield alignment technology applied to boards or chip in semiconductor packaging process.
Vertical integration covering upstream, midstream and downstream to develop a supply chain platform for a global semiconductor industry
Advanced semiconductor processes and capacity expansion have enabled Topco to leverage related advanced materials to showcase a series of featured products. The list includes silicon wafers, furnace tube quartz used in diffusion processes, CMP slurries, thin films, special chemicals applied to etching processes, as well as EUV and DUV photoresists, mask blanks and pellicles for lithography processes.
Topco will reveal a total solution in packaging and testing applicable to advanced processes, including high thermal-resistant release tape, packaging materials that offer excellent insulation and moisture resistance to semiconductors, high performance thermally conductive films, tapes, gaskets and modules, insulation gaskets, and more.
In addition to materials and equipment for semiconductor processes, Topco is actively developing semicon-ductor integration services to find the ideal OEMs for IC design companies which also accelerate time to market. The continuously growing sales have encouraged Topco to further cultivate wafer foundry supply chain partnerships and provide a comprehensive wafer start service.
Topco is committed to the role of an industry integrator and technology provider and keeps looking for the right strategic alliances and partners. In recent years, Topco has aggressively taken the company global by establishing a new company in Arizona, USA, as well as planning new sites in Nagoya and Kumamoto, Japan, to provide local support. Topco has also set up plans to exploit more overseas markets including Singapore, Vietnam and Malaysia.
Targeting opportunities of key materials for 5G and 3rd generation semiconductor applications
In response to increasing demand by emerging applications like AIoT, 5G, automotive and high-performance computing, Topco has introduced new low-κ and heat dissipation products essential for the 5G era, and is also developing value-added technologies and services and seizing other opportunities related to 5G key materials, the 3rd generation semiconductor and electric vehicle markets. In SEMICON Taiwan 2022, Topco plans a “3rd generation semiconductor and 5G applications zone” to showcase products including quartz cloth featuring low dielectric loss, high thermal resistance and dimensional stability, low-κ and high-adhesion BMI resin (SLK film), and GaN on QST wafers applicable to high voltage and high frequency components above 650V.
Features like low loss and high heat resistance make the quartz cloth an ideal core material for 5G ultra-high speed layout board. On the other hand, characteristics including low loss, high heat resistance and excellent bonding with copper foil make BMI resin perfect for electric components, PCBs, antennas and radar domes applied to the high-frequency spectrum of 5G. Also, GaN on QST wafers that combine lattice orientation via an AIN substrate with a thermal expansion coefficient similar to GaN are suitable for high voltage and high frequency components above 650V.
Developing a comprehensive solution incorporating a circular economy and green energy as a response to net zero carbon emission
Topco is teaming with group subsidiaries “ECO Technical Services”, “Suzhou Topco”, “Jia Yi Energy”, “Unitech” and “Tai Ying”, to introduce the service scope of a circular economy in SEMICON Taiwan 2022. Topco is a pioneer in environmental engineering and water treatment technology and has proactively established water purification and wastewater treatment recycling and also developed services that include chemicals and equipment for water treatment, industrial waste collection and recycling. This includes the reuse of calcium fluoride sludge resources as flux in steel plants and integration with green energy expansion, environmental evaluation and monitoring and CFV.
Topco is addressing the green trend in the global electronics industry and integrating advanced environmental engineering as well as continuously developing and representing related equipment and materials. Topco has partnered with Merck, a leading science and technology company, to introduce alternate green chemicals. Merck has been devoted to the development of green chemicals for many years and has launched over 1,400 green and sustainable products. All these have been compliant with the twelve principles of green chemistry, sustainable design concept and environmental footprint reduction. The goal of product development is to substitute frequently used organic solvents harmful to humans and environment and shape new opportunities for green transformation of the electronics industry.
Topco Scientific Joins 2022 SEMICON Taiwan at Nangang Exhibition Center, September 14th -16th
▍Booth information at 2022 SEMICON Taipei
◆Time: 10:00 – 17:00, September 14th -16th , 2022
◆Location: Booth#M1238 & M1248, 4F, Hall 1, Taipei Nangang Exhibition Center (No. 1, Jingmao 2nd Rd., Nangang Dist., Taipei)
◆Introduction:
▍TechXPOT
◆Time: AM 10:40-11:20, September 15th, 2022
◆Location:Booth#L1200, 4F, Hall 1, Taipei Nangang Exhibition Center
◆Topic:
10:40 – 11:00 Low porosity coating technology for Semiconductor Parts
Speaker: Mr. Archy Wu, Project Manager of TOPCO SCIENTIFIC CO.,LTD.
11:00 – 11:20 Mass transfer Cu micro pin to replace solder ball in advance packaging
Speaker: Mr. Kim Lin, Project Manager of TOPCO SCIENTIFIC CO.,LTD.
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Press Contacts
Della Huang
- TOPCO SCIENTIFIC CO.,LTD.
- Senior Deputy General Manager
- Stock Affair Office
Luyi Wu
- TOPCO SCIENTIFIC CO.,LTD.
- Project Manager
- Marketing & PR Dept.