Epoxy Mold Compound for IC Packaging
Epoxy resin is a polymer thermosetting material, mainly used for IC and passive component packaging to protect internal chips from environmental damage and have an insulating effect.
With low stress, high heat dissipation characteristics.
Production Intro
Use：
- For IC Package encapsulating.
- Diode Encapsulation
- Transistor package
Spec
- 15kg/can
- Low temperature storage: below 5 degrees Celsius
