Topco proudly launches innovative products at SEMICON Taiwan 2022
A technological revolution guided by world-leading nano coating technology and the mass transfer of Cu micro pins
Topco Scientific (5434), a major integrated service provider of semiconductor and key photoelectric materials, will showcase comprehensive solutions to the semiconductor supply chain: from semiconductor integration services, featured products for wafer fabrication to packaging and testing, as well as 3rd generation semiconductor and 5G applications in “SEMICON Taiwan 2022” from September 14 to 16 on the 4th floor, Taipei Nangang Exhibition Center, Hall 1.
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As a major integrated service provider of semiconductor and key photoelectric materials, Topco presents two innovative technologies: “Low porosity coating technology for Semiconductor Parts” and “Mass transfer of Cu micro pins to replace solder ball in advance packaging”, at “SEMICON Taiwan 2022” on the morning of September 15 in the Taipei Nangang Exhibition Center. These two innovations, applied to wafer fabrication and packaging and testing, can provide low porosity coating technology and corrosion-resistant porosity reducing materials as well as support high-yield alignment technology for boards or chips in semiconductor packaging processes.
World-leading low porosity nano coating technology
After long-term collaboration with the industry, Topco is releasing “Low porosity coating technology for Semiconductor Parts” to provide a comprehensive material solution.
The processing gases used in advanced semiconductor equipment are usually corrosive and a special coating is required to protect the walls of the vacuum chambers and also to avoid the lower yields caused by the dust generated by corrosion. Porosity control plays a crucial role in coating technology. This technology allows control of pore size and affects the potential amount of dust produced inside the vacuum chamber.
Technologies in advanced coating technology, including atmospheric plasma spray, suspension plasma spray, aerosol deposition and atomic layer deposition, can effectively reduce the porosity during a coating process. The key is to determine the appropriate technology and components.
This Topco low porosity coating solution can achieve a porosity of less than 3%, it can even be close to zero, and various plans are available which have high cost-efficiency. Different technical conditions are used to lower the porosity of coatings and the resistance of the sealing material to gaseous corrosion is a key to material enhancement as well as to the lessening of porosity. The powder or liquid raw material used in this Topco coating technology contains various rare earth compounds and has been massively applied to semiconductor equipment, with a scale from micro- to nano-grade. Topco provides a customized service to support customer demand for many different products with low porosity coating.
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New era of advanced packaging achieved by Mass transfer of Cu micro pins
After working in collaboration with FINECS, Topco has released high precision micro pin solutions applicable to advanced semiconductor packaging. The rapid development of chip integration technology has enhanced the usability of micro pins in a significant way that allows the pins to act as supporting pillars of the structure of a large-sized package in high-density I/O and fine-pitch interconnections. FINENS’ micro pin processing technology is applicable to a size as small as 65µm to address different package dimensional requirements.
Mechanically processed micro pins on an I/O package require high-yield alignment technology for their assembly on the board or chip. FINECS also unveils high precision alignment equipment solutions that enables the clients to implement mass alignment of micro pins in a large area quickly through a process introduced by proprietary technology. This not only accelerates the development of packages manufactured by fine pitch technology, but also provides a comprehensive solution with the high stability necessary for mass production.
With the accumulated manufacturing experiences and automated production through years, FINECS dominates the global market of PGA for CPU packaging and provides various electronic components as well as automotive accessories. By leveraging advanced technologies including mold, stamping, forming and surface treatment, FINECS is capable of offering microelectronic devices with high precision component processing solutions.
Topco Scientific will showcase an integration service for the semiconductor supply chain: from IC design, to featured products for wafer fabrication, to packaging and testing, to development technology, as well as 3rd generation semiconductor and 5G applications at “SEMICON Taiwan 2022” from September 14 to 16 on the 4th floor, Taipei Nangang Exhibition Center, Hall 1. In the “Circular economy” zone, Topco will reveal services supporting green industries, including 100% wastewater recycling and zero emission technology, as well as ammonia nitrogen wastewater treatment, cleanroom construction and CFV (carbon footprint verification).
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▍2022 SEMICON Taiwan
◆Time: AM 10:40-11:20, September 15th, 2022
◆Location:Booth#L1200, 4F, Hall 1, Taipei Nangang Exhibition Center
◆Topic:
10:40 – 11:00 Low porosity coating technology for Semiconductor Parts
Speaker: Mr. Archy Wu, Project Manager of TOPCO SCIENTIFIC CO.,LTD.
11:00 – 11:20 Mass transfer Cu micro pin to replace solder ball in advance packaging
Speaker: Mr. Kim Lin, Project Manager of TOPCO SCIENTIFIC CO.,LTD.
▍Technical Support Contact
Mr. Archy Wu, Project Manager +886-2-8797-8020#2790 archy.wu@topco-global.com
Mr. Kim Lin, Project Manager +886-2-8797-8020#2832 chichin.lin@topco-global.com
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Della Huang
- TOPCO SCIENTIFIC CO.,LTD.
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Luyi Wu
- TOPCO SCIENTIFIC CO.,LTD.
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