Solder paste
Mixture of solder powder, flux and activator. For electric component to be mounted on substrate and PCB. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 7.
Production Intro
Description
- Fit small component and narrow pitch
- Excellent workability
- Excellent soldering performance and process yield
- Low voiding, bridging, tombstoning
Spec
- Jar ( 250g/500g )
Product Contact
Posen Tseng
- TOPCO SCIENTIFIC CO.,LTD.
- Manager
- Electronics Div Ⅱ., 3rd Business Unit
No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.2888
