Diamond Wire
Diamond wire (DW) is regarded as the best cutting tools for the hard and brittle materials such as silicon for semiconductor, PV solar, sapphire wafer, magnetic materials with high efficiency and low cost.
Production Intro
Description
- Diamond grit : Control the advanced separation and electroplating technology to realize the self-guarantee of diamond grit.
- Core wire : Cooperate with the core wire manufacturer both domestic and overseas to develop core wire with high tension & strength to realize the mass production of 50 um, 40 um or even thinner silicon slicing DW.
Spec
- Main products :
Spec
Main products :
| Type | EDW for PV/LED/Optics/Semiconductor industries |
| Specification | Diameter : 0.04 mm~0.45 mm |
| Cutting field | To slice silicon/sapphire/SiC ingot |
| R&D direction | ．Less than 0.040 mm ．High speed cutting (for MB288S3, PV600DT, Takatori) ．Higher efficiency, lower wire consumption, Warp data ．For all kinds of cutting machine and cutting recipe |
Product Contact
Sam Lin
- TOPCO SCIENTIFIC CO.,LTD.
- Sales Assistant Manager
- Advanced wafer & material Sales Dept.Ⅰ, Advanced wafer & material Div., 2nd Business Unit
4F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3413
